Semiconductor Technology Platforms

Over 500 million IC, Discrete Semiconductor and MEMS die shipped each year

Questsemi foundry process capability supports many technology platforms in MEMS, Integrated Circuits and Discrete semiconductors.

Since 1986 Semefab has engaged with a wide variety of organizations, from fabless chip companies, OEM’s and start-ups to major semiconductor manufacturers, inducting and developing their semiconductor processing technologies.

Most customer relationships last for many years and as technology and equipment capabilities have advanced, Semefab has worked closely with its customer base to allow them to take advantage of next generation products and designs.

Over time we have developed extremely robust management practices and operational procedures which allow Semefab to efficiently run many concurrent processes from MEMS through to Integrated Circuits and Discrete Semiconductor devices across 3 wafer fabs, under tight discipline and at high yields. Each process is fully documented, subject to FMEA and statistical process control. Our highly experienced Process and Equipment Engineering Teams are able to investigate any deviations from control limits and are quickly able to rectify matters should any problem arise.

A quality control plan is agreed for each specific product/process according to discussion and agreement with the customer. Quality control procedures are implemented according to Semefab’s Quality Policy and ISO 9001 management procedures. Performance is reviewed monthly by the entire management team and our system is audited annually by the British Standards Inspectorate. Semefab issues a quality control certificate of conformance with every shipment of its product.

FAB 1
Semefab’s Fab1 is a 900 square metre class 100 operation (class 10 Photo) supporting 4″ volume foundry. CMOS (20V to 5V); Linear IC (40V/60V); Dielectrically Isolated BiCMOS (100V); small signal low noise JFET; RF MOSFET (12V/50V 1GHz); N & P Channel Lateral MOSFET (200V 8A); Photodiode; Fast Recovery Diode and MEMS (front end).

Minimum feature size capability 2.5µm.

FAB 2
Semefab’s MEMS Fab2 is a 800 square metre class 100 operation (class 10 Photo) supporting 6″ & 4″ volume foundry of MEMS technologies.

Pressure Sensor; Thermopile; Gas Sensor; Strain Gauge; Accelerometer; Airflow Sensor; Blood Viscosity; Blood Analysis; Medical MEMS devices.

Semefab has strategic interest in the MEMS Energy Harvesting and Medical MEMS/Health Tech sectors.

Minimum feature size capability 0.8µm.

FAB3 
Semefab’s MEMS Fab3 is a 1500 square metre class 100 operation (class 10 Photo) supporting 6″ volume foundry.

CMOS (10V to 3V); OPTO CMOS (10V to 3V); MEMS (front end).

Minimum feature size capability 0.8µm.

Semefab’s volume/value proposition ensures cost-effective development leading to seamless transition into volume manufacture. We ensure optimum transfer of knowledge and know-how from the process development team to the manufacturing process engineering team. 

All three Fabs operate under ISO9001 & ISO14001 accredited procedures.

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